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Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over …
In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions towithstand high temperature condition over 220oC. Instead ofconventional thick wire bonding on the device, the flip chipbonding for high power source and gate …
Miniaturized Battery‐Free Wireless Systems for Wearable Pulse Oximetry
Development of unconventional technologies for wireless collection and analysis of quantitative, clinically relevant information on ... Ultraminiaturized, lightweight, and battery-free devices have the potential to establish complementary options in biointegration on ...
The drive to miniaturization
Following the introduction of silicon-based integrated circuitry over three decades ago, the integration density of such circuits has doubled every 12 to 18 months: this observation ...
Novel Packaging Structure and Processes for Micro-TFB (Thin Film Battery) to Enable Miniaturized …
In this work, a novel packaging structure has been demonstrated for micro-TFB cells. Various semiconductor fabrication and assembly processes have been applied to thin substrate via formation and sealing, micro-TFB singulation and handling, as well as metallic sealing for hermetic battery packaging. Micro-TFB cells in the dimensions of 2.5mm x …
Miniature battery-free bioelectronics
The wealth of energy-harvesting, WPT, and communication technologies provides a rich toolbox for creating next-generation battery-free bioelectronics that can be miniaturized and long-lasting in ways that battery-powered devices cannot.
Miniaturized lithium-ion batteries for on-chip energy …
Designing a reasonable microelectrode configuration is one of the significant factors for obtaining the preferable performances of micro-LIBs. Since micro-LIBs typically cover a total area of 1 mm 2 to 1 cm 2, microelectrodes …
Emerging miniaturized energy storage devices for microsystem …
Emerging miniaturized energy storage devices for microsystem applications: from design to integration, Huaizhi Liu, Guanhua Zhang, Xin Zheng, Fengjun Chen, Huigao Duan In recent years, the ever-growing demands for and integration of micro/nanosystems, such ...
The future of near-field communication-based wireless sensing
Near-field communication (NFC) emerged as a high-security, wireless, short-range, data exchange technology nearly two decades ago; its ability to simultaneously transfer power and data between ...
Novel Packaging Structure and Processes for Micro-TFB (Thin Film Battery) to Enable Miniaturized …
In this work, a novel packaging structure has been demonstrated for micro-TFB cells through semiconductor fabrication and assembly processes, as well as metallic sealing for hermetic battery packaging. In this work, a novel packaging structure has been demonstrated for micro-TFB cells. Various semiconductor fabrication and assembly …
The future of near-field communication-based wireless sensing
Near-field communication emerged as a high-security, wireless, short-range, data exchange technology nearly two decades ago; its ability to simultaneously transfer power and data between devices ...
Miniaturized lithium-ion batteries for on-chip energy storage
Finally, the challenges and future perspectives of miniaturized lithium-ion batteries are elaborated with respect to their potential application fields. Customizable miniaturized lithium-ion batteries are expected to play an irreplaceable role as on-chip power supplies for smart microelectronics and advanced microsystems.
Millimeter-scale lithium ion battery packaging for high …
By considering these problems, here we present packaging of miniaturized rechargeable lithium batteries by using "3D printing" casings for high …
A Review of SiC Power Module Packaging Technologies: …
Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this transition, with an emphasis on the challenges …
How Miniaturized Distributed Modular Architecture Advances Avionics Design
Most of today''s collision-avoidance, in-flight-entertainment (IFE), air-to-ground-communications, and other avionics systems employ electronics packaging based on the Aeronautics Radio INC (ARINC) 600 standard. Compared to the older ARINC 404 standard dating from the 1970s that defined "black box" enclosures and racks within …
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY 1 Miniaturized …
V. Sundaram, and R. R. Tummala are with the Georgia Institute of Technology, Atlanta, GA 30332 USA (e-mail: srikrishna.sitaraman@gmail ). Y. Kim and J. Kim are with the Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea.
[PDF] Miniaturized and Battery-Free Temperature and Humidity Sensor for Smart Pharmaceutical Packaging …
This work presents the design and experimental characterization of a miniaturized battery-less RFID sensor, able to simultaneously measure temperature and humidity, and is compatible with the insertion into a capsule, similar to common drugs. Temperature and humidity levels inside pharmaceutical packaging can significantly affect the shelf life of …
Batteryless Wireless Temperature/Humidity Sensor for Item-level Smart Pharma Packaging …
This work proposes an item-level smart packaging solution based on RFID technology to measure wirelessly and without embedded battery source the temperature and relative humidity inside a pharmaceutical pill packaging. In the Industry 4.0 era, pharmaceutical industries demands for technologies to guarantee for drug safety by monitoring the …
The quest for miniaturized soft bioelectronic devices
Soft integrated electronics packaged with miniaturized modules for wireless power and data transfer are opening up new opportunities for long-term health monitoring …
A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology …
A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology for W-Band Application Abstract: In this letter, an ultra-compact wideband stepped impedance resonators'' (SIR) interdigital bandpass filter (IBPF) is proposed based on through-silicon via (TSV) and three-dimensional integrated circuit (3-D IC) technology.
Millimeter-scale lithium ion battery packaging for high-temperature sensing applications …
Miniaturized batteries contain electrochemically active components which must be protected from moisture, air, and mechanical stresses, therefore, packaging the battery components within millimeter configuration is extremely challenging for …
Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
Advances in high-performance MEMS pressure sensors
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized …
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices for ECTC 2019 by Bing Dang et al. Abstract In this work, a novel packaging structure has been demonstrated for micro-TFB ...
Miniature battery-free bioelectronics
The extreme miniaturization and long functional lifetime that are enabled by battery-free technologies point toward a future in which networks of tiny bioelectronics could be distributed throughout the body to accurately …
Review article Nano Revolution: "Tiny tech, big impact: How nanotechnology …
Nano Revolution: "Tiny Tech, Big Impact
A 3-D stacked chip packaging solution for miniaturized massively …
The development and evaluation of a three-dimensional (3-D) interconnect and packaging technology for massively parallel processor (MPP) implementation is reported. Following reviews of specific modular massively parallel computer (MPC) accelerator and chip stacking technologies, the paper reports the progress of a collaborative research project to …
Novel Packaging Structure and Processes for Micro-TFB (Thin …
In this work, a novel packaging structure has been demonstrated for micro-TFB cells. Various semiconductor fabrication and assembly processes have been applied to thin …
Miniaturized and battery-free temperature and humidity sensor for …
RFID technology in the context of smart packaging for pharma, by proposing the design of a fully-passive transponder for simultaneous temperature and relative humidity monitoring
Integration of microbattery with thin-film electronics for …
A full integration of miniaturized transparent energy device (lithium-ion battery), electronic device (thin-film transistor) and sensing device (photodetector) to …
When is a Miniaturized PCBA the Right Option for You?
iNPACK ( a subsidiary of PCB Technologies ) is at the forefront of the miniaturized PCBA evolution, and we''d like you to join us there! This blog explores some of the major benefits, unique features, and diverse applications central to miniaturized PCBA design and can hopefully help you determine when it''s the right technology choice for …
Design and Manufacture of 3D-Printed Batteries
Design and Manufacture of 3D-Printed Batteries
Packaging Technology for Devices in Autonomous Sensor Networks
Autonomous sensor network (ASN) node comprises of multiple miniaturized sensors, actuators, controller-circuitry and power source. Packaging and integration of these components play a critical role in determining the overall system performance, cost and time
Characteristics of Li-ion micro batteries fully batch fabricated by …
A cost-effective and reliable technology allowing extreme miniaturization of batteries into glass chips and electronic packages has been developed, employing a …